MediaTek Dimensity 8450 – mid-range chip on TSMC’s 4nm process

MediaTek Helio G80

 

MediaTek has officially announced the Dimensity 8450, a new mobile processor that replaces the Dimensity 8400 model that debuted in December 2024. Although the architecture remains unchanged, the new product has received a number of internal improvements.

 

The MediaTek Dimensity 8450 is manufactured using TSMC’s second-generation 4nm process technology. It has one Cortex-X4 core (3.25 GHz), three Cortex-A720 (3.0 GHz) and four Cortex-A520 (2.1 GHz). The Mali-G720 MC7 graphics unit is complemented by the new StarSpeed ​​​​Engine technology, which improves the real-time gaming experience.

 

The updated ISP module provides better quality live broadcasts and support for cameras up to 320 MP HDR without lag. The NPU 880 neural module has also been improved, which, in combination with the Agentic AI Engine, allows for AI calculations directly on the device.

 

The chip’s modem supports UltraSave 3.0+ energy-saving technology to reduce power consumption in 5G networks. It is expected that smartphones based on the Dimensity 8450 will appear on the market in the coming months.


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