Xiaomi 18 Fold Set for September Launch With New Xring O3 Chip

Xiaomi has officially confirmed it is ready to launch its next generation of foldable smartphones. Contrary to expectations, the model will not be released as the Mix Fold 5, but under the name Xiaomi 18 Fold. The presentation of the long-awaited new product is scheduled for September of this year.

What to Know About Xiaomi 18 Fold Specs and the Xring O3 Processor

A key feature of the device will be the debut of Xiaomi’s own processor — the Xring O3. This is a direct successor to the Xring O1 chip released last year. During AnTuTu V11 benchmark tests, the new chip achieved a record-breaking score of 5,228,014 points, making it the most powerful solution among smartphones currently on the market.

CPU and Graphics Performance

The Xring O3 processor is equipped with a powerful deca-core CPU, which includes the following configuration:

• 2 C1-Ultra cores with a clock speed of up to 4.35 GHz
• 4 C1-Premium cores with a clock speed of up to 3.68 GHz
• 4 C1-Pro cores with a clock speed of up to 3.15 GHz

Benchmark Results

In comprehensive Geekbench 6.5 testing, the chip scored 3,945 points in single-core mode and 15,221 points in multi-core mode. Although the Apple A19 Pro still maintains the lead in single-core performance, the Xring O3 has virtually no competitors in multi-core performance.

Graphics Accelerator Dominance

The graphics processor inside the chip also shows impressive growth. In specialized tests, performance gains relative to the previous generation (Xring O1) were 85%, 94%, and 182%, respectively. It is also worth noting that the Xring O3 outperforms the Apple A19 Pro in all three tests presented by Xiaomi.

Technological Features and RAM

The platform supports modern LPDDR6 RAM, providing a bandwidth of up to 113.8 GB/s. Thanks to Xiaomi’s own developments, the new chipset promises to be a serious competitor to flagship solutions from Qualcomm, MediaTek, and Apple.